Overview

Introduction

This course is to deepen the knowledge and skills of participants to enable them to undertake engineering functions in the field of IC Assembly & Test in the semiconductor industry. 

Upon completing the course, the graduates will be equipped to undertake the following engineering functions:

  • equipment engineering
  • product test engineering
  • process engineering

Target Participants

Fresh polytechnic graduates from Engineering or related courses.

Career Opportunities

At the entry level, the job positions are Associate Engineers. Upon completing the course under the Earn and Learn Programme, graduates can look forward to role expansion in their work scope. They can also look forward to upgrading their knowledge and skills through further CET and executive programmes offered by local Institutes of Higher Learning.

Course Details

Course Commencement 

The Earn and Learn Programme will commence in April 2017.

Course Duration

Participants will undergo a 12-month structured training programme, including facilitated learning, professional certification and on-the-job training.

Application Period

November 2016 to March 2017

Course Structure

To be awarded the Specialist Diploma in Wafer Fabrication, ELP students are required to complete a total of 2 Post-Diploma Certificates (PDCs). Each PDC can be completed in 1 semester, ie. 6 months. A certificate will be issued once the requirements for each PDC are met. ELP students must complete the course within 12 months.

Post-Diploma Certificate in IC Manufacturing and Equipment

Subject code Subject
ECMF204

This subject provides knowledge and skills of the various techniques and concepts in Applying Good Manufacturing Practices and Factory Systems that are widely used in the Assembly & Test sector. It also provides occupational knowledge and skills to adopt systematic approaches in managing problems and making decisions in a technical environment. It covers best practices in production areas, workplace safety and health, identifying non-conformances of good manufacturing practices and makes corrective actions against them; monitor, update and generate reports from Factory Systems. It also covers effective problem-solving and decision-making methodologies which include root cause analysis, alternatives and/or solutions, decision making on approaches to implement solutions and evaluate effectiveness of solution.

ECMF205

This practice-based subject provides the know-how and practical skills in automation technology and equipment troubleshooting for the manufacturing industry. Topics covered include the assembly and commissioning of automation systems, pneumatics, electrical/electronic systems, common equipment modules such as AC-DC power distribution, pneumatic circuits, and safety systems. The analysis of equipment schematics and the troubleshooting of equipment modules will be taught through practical sessions.

Post-Diploma Certificate in IC Process Technology

Subject code Subject
ECMF206

This subject provides knowledge and skills in areas of Integrated Circuit (IC) assembly. It covers various semiconductor assembly processes, material properties, packaging technologies, Integrated Circuit (IC) Failure Analysis (FA) techniques, failure mechanisms and reliability test. It also covers the process flow and techniques of failure analysis, and the use of various types of equipment in identifying the root cause of IC failures.

ECMF207

This subject provides knowledge and skills on the modules of the test and measurement of semiconductor devices including digital devices, mixed-signal devices and memory devices.  The subject also covers the methodology to develop test program according to device specifications and debugging of program errors.

ECPJ201

In this subject, students will integrate and apply their knowledge as well as skills learned to their project in a practical environment. The emphasis will be on knowledge and skills application innovation and creativity.  The project nature should be of the following nature:

  • It must be a substantial work related to an industrial program.
  • It may be an innovative product, system or process; or an improvement to existing product, system or process.
  • It may include some form of developmental work and evaluation of workable designs and implementation of ideas. 

The company project will commence concurrently with Post-Diploma Certificate in Wafer Fabrication Equipment Technology.

Modes of Assessment

Class Participation

Quizzes

Test

Laboratory work

Assignment

Project

Course Fees

Category

PDC in IC Manufacturing and Equipment

 PDC in IC Process Technology

Enhanced Training Support for SME Scheme

$278.04

$417.06

Singapore Citizens below the age of 40

$398.04

$597.06

Singapore Permanent Residents

$1,052.88

$1,579.32

(nett fee payable inclusive of GST)

MOE subsidy will not be applicable for students who repeat a module or semester.
Fees payable is based on per PDC.
The course fees will be reviewed by MOE on an annual basis and adjusted accordingly.

Eligibility Criteria

Fresh polytechnic graduates from Engineering or related courses who are Singaporeans or Permanent Residents are eligible to apply. [Fresh graduates are defined as individuals who are hired by participating companies and officially commenced Earn & Learn Programme within 12 months of graduating. For male participants who need to complete National Service (NS), the 12-month period will start from their Operationally-Ready Date (ORD).] 

Polytechnic graduates who have graduated more than 12 months but less than 5 years can still be considered for the course on a case-by-case basis but will not be eligible for any sign-on incentives. 

Application and Enquiries

 Interested applicants may email the following documents with the subject “ELP Electronics/ Specialist Diploma in IC Assembly & Test” to Ms Jacelyn Neo | jacelynn@tp.edu.sg

  1. Resume
  2. Highest Qualification
  3. NRIC
  4. National Service Completion Certificate (if applicable)
  5. Relevant Supporting Document such as Testimonial

Please note that all resumes will be forwarded to all participating companies for their selection.

Selection of applicants is at the discretion of the participating companies and participating companies will contact their shortlisted applicants for interview. Applicants have the right to reject the interview if they are not comfortable in working with the company who contacted them.

Only applicants who are hired by the participating companies will be invited to submit an online application for the Earn and Learn Programme.

Temasek SkillsFuture Academy
Temasek Polytechnic
(South Wing Block 26B, Level 1, Unit 49)
21 Tampines Ave 1
Singapore 529757 

Opening Hours
8.30 am to 7.00 pm (Mon to Fri)
Closed on Sat, Sun & Public Holidays 

Contact Details
6788 1212
tsa@tp.edu.sg
  http://www.tp.edu.sg/tsa

Temasek Polytechnic reserves the right to alter the course, modify the scale of fee, amend any other information or cancel course with low enrolment.

Last updated 24 April 2017


 
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