Overview

Introduction

This SkillsFuture Earn & Learn Programme for the Electronics sector is a 12-month work-study programme leading to the Specialist Diploma in IC Assembly & Test. It aims to deepen the knowledge and skills of participants to enable them to undertake engineering functions in the field of IC Assembly & Test in the semiconductor industry. 

Upon completing this ELP, graduates will be equipped to undertake the following engineering functions:

  • equipment engineering
  • product test engineering
  • process engineering

Target Participants

Please see Eligibility Criteria for more information.

Career Opportunities

At the entry level, the job positions are Associate Engineers1.

Upon completing the course under the Earn and Learn Programme, graduates can look forward to role expansion in their work scope. They can also look forward to upgrading their knowledge and skills through further CET and executive programmes offered by local Institutes of Higher Learning.

Academic Progression 

Graduates of this ELP Electronics (IC Assembly & Test) programme may enjoy credit recognition if they undertake the Bachelor of Engineering in Electronics offered by the Singapore University of Social Sciences, subject to meeting the entry requirements of the institution. 

1 Job titles may vary across companies

Course Details

Course Commencement 

The Earn and Learn Programme will commence in every April and/or October.

Course Duration

Participants will undergo a 12-month structured training programme, including facilitated learning, professional certification and on-the-job training.

Application Period

Application for ELP is on-going. Please contact us to find out more.

Course Structure

To be awarded the Specialist Diploma in Wafer Fabrication, ELP students are required to complete a total of 2 Post-Diploma Certificates (PDCs). Each PDC can be completed in 1 semester, ie. 6 months. A certificate will be issued once the requirements for each PDC are met. ELP students must complete the course within 12 months.

Post-Diploma Certificate in IC Manufacturing and Equipment

Subject code Subject
ECMF204

This subject provides knowledge and skills of the various techniques and concepts in Applying Good Manufacturing Practices and Factory Systems that are widely used in the Assembly & Test sector. It also provides occupational knowledge and skills to adopt systematic approaches in managing problems and making decisions in a technical environment. It covers best practices in production areas, workplace safety and health, identifying non-conformances of good manufacturing practices and makes corrective actions against them; monitor, update and generate reports from Factory Systems. It also covers effective problem-solving and decision-making methodologies which include root cause analysis, alternatives and/or solutions, decision making on approaches to implement solutions and evaluate effectiveness of solution.

ECMF205

This practice-based subject provides the know-how and practical skills in automation technology and equipment troubleshooting for the manufacturing industry. Topics covered include the assembly and commissioning of automation systems, pneumatics, electrical/electronic systems, common equipment modules such as AC-DC power distribution, pneumatic circuits, and safety systems. The analysis of equipment schematics and the troubleshooting of equipment modules will be taught through practical sessions.

Post-Diploma Certificate in IC Process Technology

Subject code Subject
ECMF206

This subject provides knowledge and skills in areas of Integrated Circuit (IC) assembly. It covers various semiconductor assembly processes, material properties, packaging technologies, Integrated Circuit (IC) Failure Analysis (FA) techniques, failure mechanisms and reliability test. It also covers the process flow and techniques of failure analysis, and the use of various types of equipment in identifying the root cause of IC failures.

ECMF207

This subject provides knowledge and skills on the modules of the test and measurement of semiconductor devices including digital devices, mixed-signal devices and memory devices.  The subject also covers the methodology to develop test program according to device specifications and debugging of program errors.

ECPJ201

In this subject, students will integrate and apply their knowledge as well as skills learned to their project in a practical environment. The emphasis will be on knowledge and skills application innovation and creativity.  The project nature should be of the following nature:

  • It must be a substantial work related to an industrial program.
  • It may be an innovative product, system or process; or an improvement to existing product, system or process.
  • It may include some form of developmental work and evaluation of workable designs and implementation of ideas. 

The company project will commence concurrently with Post-Diploma Certificate in Wafer Fabrication Equipment Technology.

Modes of Assessment

Class Participation

Quizzes

Test

Laboratory work

Assignment

Project

Course Fees

Category

PDC in IC Manufacturing and Equipment

 PDC in IC Process Technology

Enhanced Training Support for SME Scheme

$291.72

$437.58

Singapore Citizens below the age of 40

$423.72

$635.58

Singapore Permanent Residents

$1,129.92

$1,694.88

Others & Repeat Students

$2,824.80

$4,237.20

(nett fee payable inclusive of GST)

MOE subsidy will not be applicable for students who repeat a module or semester.
Fees payable is based on per PDC.
The course fees will be reviewed by MOE on an annual basis and adjusted accordingly.

Eligibility Criteria

Eligibility Criteria for ELP Electronics

Singaporeans or Singapore Permanent Residents who are within three years of either graduation from the polytechnics or the Operational Ready Date (ORD) for National Servicemen from relevant full-time engineering-related courses of study are eligible to apply.

Eligibility Criteria for ELP Sign-on Incentive

Only for Singapore Citizens who are fresh ITE or Polytechnic graduates hired by Participating Companies and officially commenced ELP within 3 years of graduation or ORD.

Application and Enquiries

Individuals

Interested applicants may email the following documents with the subject “ELP Electronics/ Specialist Diploma in IC Assembly & Test” to Ms Chelsia Lim chelsia@tp.edu.sg

  1. Resume
  2. Highest Qualification Certificate & Transcripts
  3. NRIC
  4. National Service Completion Certificate (if applicable)
  5. Relevant Supporting Document such as Testimonial (optional)

Please note that all resumes will be forwarded to all participating companies for their selection.

Selection of applicants is at the discretion of the participating companies and participating companies will contact their shortlisted applicants for interview. Applicants have the right to reject the interview if they are not comfortable in working with the company who contacted them.

Only applicants who are hired by the participating companies will be invited to submit an online application for the Earn and Learn Programme. 

Employers

Companies in the semiconductor industry who are interested to find out how ELP can support your organisation’s talent development plan may contact the following personnel for more information:


 
EVENTS   | All Events
04
JAN

TP Openhouse 2018

Temasek Polytechnic
04 - 06 Jan 18
06
JAN

Beyond 'O' Level Seminar 2018

Temasek Polytechnic
06 Jan 18
31
JAN

TP Opportunity Fair 2018

Temasek Polytechnic, Auditorium 1 & 2 Foyer
31 Jan 18