This course is to deepen the knowledge and skills of participants to enable them to undertake engineering functions in the field of wafer fabrication in the semiconductor industry 

Upon completing the course, the graduates will be equipped to undertake the following engineering functions:

  • wafer fabrication manufacturing practices
  • various core processes of wafer fabrication
  • equipment engineering and troubleshooting

Target Participants

Fresh polytechnic graduates from Engineering or related courses.

Career Opportunities

At the entry level, the job positions are Associate Engineers. Upon completing the course under the Earn and Learn Programme, graduates can look forward to role expansion in their work scope. They can also look forward to upgrading their knowledge and skills through further CET and executive programmes offered by local Institutes of Higher Learning.

Course Details

Course Commencement 

The Earn and Learn Programme will commence in April 2017.

Course Duration

Participants will undergo a 12-month structured training programme, including facilitated learning, professional certification and on-the-job training. 

Application Period

November 2016 to March 2017

Course Structure

To be awarded the Specialist Diploma in Wafer Fabrication, ELP students are required to complete a total of 2 Post-Diploma Certificates (PDCs). Each PDC can be completed in 1 semester, ie. 6 months. A certificate will be issued once the requirements for each PDC are met. ELP students must complete the course within 12 months.

Post-Diploma Certificate in Wafer Fabrication Manufacturing & Process

Option A: Manufacturing Practices

Subject code Subject

This subject provides students with the knowledge and skills of the various techniques and concepts used in Applying Semiconductor Good Manufacturing Practices and Managing Semiconductor Manufacturing Execution System (MES) that are widely used in the wafer fabrication Industry. Good manufacturing practices requirements and cleanroom protocols, operations of the Manufacturing Execution System and the application in tracking tool and lot status will be included.


This subject provides students with the knowledge and skills of the various techniques and concepts in Applying Environmental, Health and Safety (EHS) Practices that are widely used in the wafer fabrication industry. It covers responsibilities under EHS Act, hazards, risk assessment, and safe work procedures as well as knowledge and/or practice of sustaining the environmental health and safety. Knowledge of these techniques will allow professional engineers to work safely and effectively so as to improve their factory performance.


This subject provides students with the knowledge and skills of the various techniques and concepts in Implementing Statistical Process Control (SPC) that are widely used in the wafer fabrication Industry. It covers basic statistics, control chart, process capability as well as application of the concepts and methodology of SPC learned. Knowledge of these techniques will allow professional engineers to improve on the processes and the company’s performance, and manage abnormal SPC trend.

Option B: Process Technology

Subject code Subject

This subject provides the basic knowledge and understanding of semiconductor materials, p-n junctions, different types of contacts to semiconductors, the Metal-Oxide-Semiconductor (MOS) capacitor and MOS Field Effect Transistor (MOSFET). The subject also covers the various types of semiconductors memory devices and fundamental aspects of Integrated Circuit (IC) layout design.


This subject provides knowledge and know-hows in engineering as well as troubleshooting of wafer fabrication process. It covers the various process technologies of IC wafer fabrication like oxidation, photolithography, etching, implantation and film deposition etc. The essential knowledge and know-hows to perform process recipe setup and troubleshooting will also be covered.

Post-Diploma Certificate in Wafer Fabrication Equipment Technology

Subject code Subject

This subject provides know-how and skills in handling vacuum systems and operating plasma equipment which are widely used in the wafer processing industry. It covers topics like high vacuum pumps, pressure gauges, vacuum materials, leak detection, plasma physics and high density plasma   technologies. The operation and maintenance of vacuum system, plasma reactors and leak detection techniques will be covered through practical sessions.


This subject provides know-how and skills in engineering and troubleshooting of wafer fabrication equipment. It covers commonly found equipment modules such as AC and DC power distribution, process gas P&ID, (pipe and instrumentation diagram), and mass flow control, heat exchangers and temperature control, wafer handling and transportation, pneumatic circuits, interlock and safety systems, as well as PID controllers. Through practical sessions, the reading of equipment schematic, diagnostic and troubleshooting of wafer fabrication equipment modules will also be covered.


In this subject, students will integrate and apply their knowledge as well as skills learned to their project in a practical environment. The emphasis will be on knowledge and skills application innovation and creativity.  The project nature should be of the following nature:

  • It must be a substantial work related to an industrial program.
  • It may be an innovative product, system or process; or an improvement to existing product, system or process.
  • It may include some form of developmental work and evaluation of workable designs and implementation of ideas. 

The company project will commence concurrently with Post-Diploma Certificate in Wafer Fabrication Equipment Technology.

Modes of Assessment

Class Participation



Laboratory work



Course Fees


PDC in Wafer Fabrication Manufacturing & Process

PDC in Wafer Fabrication Equipment Technology

Enhanced Training Support for SME Scheme



Singapore Citizens below the age of 40



Singapore Permanent Residents



(nett fee payable inclusive of GST)

MOE subsidy will not be applicable for students who repeat a module or semester.
Fees payable is based on per PDC.
The course fees will be reviewed by MOE on an annual basis and adjusted accordingly.

Eligibility Criteria

Fresh polytechnic graduates from Engineering or related courses who are Singaporeans or Permanent Residents are eligible to apply. [Fresh graduates are defined as individuals who are hired by participating companies and officially commenced Earn & Learn Programme within 12 months of graduating. For male participants who need to complete National Service (NS), the 12-month period will start from their Operationally-Ready Date (ORD).] 

Polytechnic graduates who have graduated more than 12 months but less than 5 years can still be considered for the course on a case-by-case basis but will not be eligible for any sign-on incentives. 

Application and Enquiries

Interested applicants may email the following documents with the subject “ELP Electronics/ Specialist Diploma in Wafer Fabrication” to Ms Jacelyn Neo | jacelynn@tp.edu.sg

  1. Resume
  2. Highest Qualification
  3. NRIC
  4. National Service Completion Certificate (if applicable)
  5. Relevant Supporting Document such as Testimonial

Please note that all resumes will be forwarded to all participating companies for their selection.

Selection of applicants is at the discretion of the participating companies and participating companies will contact their shortlisted applicants for interview. Applicants have the right to reject the interview if they are not comfortable in working with the company who contacted them.

Only applicants who are hired by the participating companies will be invited to submit an online application for the Earn and Learn Programme

Temasek SkillsFuture Academy
Temasek Polytechnic
(South Wing Block 26B, Level 1, Unit 49)
21 Tampines Ave 1
Singapore 529757 

Opening Hours
8.30 am to 7.00 pm (Mon to Fri)
Closed on Sat, Sun & Public Holidays

Contact Details
6788 1212

Temasek Polytechnic reserves the right to alter the course, modify the scale of fee, amend any other information or cancel course with low enrolment.

Last updated 24 April 2017

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