Overview

Introduction

ThisSkillsFuture Earn & Learn Programme for the Electronics sector is a 12-month work-study programme leading to the Specialist Diploma in Wafer Fabrication. It aims to deepen the knowledge and skills of participants to enable them to undertake engineering functions in the field of wafer fabrication in the semiconductor industry 

Upon completing this ELP, graduates will be equipped to undertake the following engineering functions:

  • wafer fabrication manufacturing practices
  • various core processes of wafer fabrication
  • equipment engineering and troubleshooting

Target Participants

Singaporeans or Singapore Permanent Residents who are fresh Polytechnic graduates from relevant full-time engineering-related courses of study.

Please see Eligibility Criteria for more information.

Career Opportunities

At the entry level, the job positions are Associate Engineers1.

Upon completing the course under the Earn and Learn Programme, graduates can look forward to role expansion in their work scope. They can also look forward to upgrading their knowledge and skills through further CET and executive programmes offered by local Institutes of Higher Learning.

Academic Progression

Graduates of this ELP Electronics (Wafer Fabrication) programme may enjoy credit recognition if they undertake the Bachelor of Engineering in Electronics offered by the Singapore University of Social Sciences, subject to meeting the entry requirements of the institution. 

1 Job titles may vary across companies

Course Details

Course Commencement 

The Earn and Learn Programme will commence in every April and/or October.

Course Duration

Participants will undergo a 12-month structured training programme, including facilitated learning, professional certification and on-the-job training. 

Application Period

Application for ELP is on-going. Please contact us to find out more.

Course Structure

To be awarded the Specialist Diploma in Wafer Fabrication, ELP students are required to complete a total of 2 Post-Diploma Certificates (PDCs). Each PDC can be completed in 1 semester, ie. 6 months. A certificate will be issued once the requirements for each PDC are met. ELP students must complete the course within 12 months.

Post-Diploma Certificate in Wafer Fabrication Manufacturing & Process

Option A: Manufacturing Practices

Subject code Subject
ECMF201

This subject provides students with the knowledge and skills of the various techniques and concepts used in Applying Semiconductor Good Manufacturing Practices and Managing Semiconductor Manufacturing Execution System (MES) that are widely used in the wafer fabrication Industry. Good manufacturing practices requirements and cleanroom protocols, operations of the Manufacturing Execution System and the application in tracking tool and lot status will be included.

ECSC201

This subject provides students with the knowledge and skills of the various techniques and concepts in Applying Environmental, Health and Safety (EHS) Practices that are widely used in the wafer fabrication industry. It covers responsibilities under EHS Act, hazards, risk assessment, and safe work procedures as well as knowledge and/or practice of sustaining the environmental health and safety. Knowledge of these techniques will allow professional engineers to work safely and effectively so as to improve their factory performance.

ECPZ201

This subject provides students with the knowledge and skills of the various techniques and concepts in Implementing Statistical Process Control (SPC) that are widely used in the wafer fabrication Industry. It covers basic statistics, control chart, process capability as well as application of the concepts and methodology of SPC learned. Knowledge of these techniques will allow professional engineers to improve on the processes and the company’s performance, and manage abnormal SPC trend.

Option B: Process Technology

Subject code Subject
ECMI201

This subject provides the basic knowledge and understanding of semiconductor materials, p-n junctions, different types of contacts to semiconductors, the Metal-Oxide-Semiconductor (MOS) capacitor and MOS Field Effect Transistor (MOSFET). The subject also covers the various types of semiconductors memory devices and fundamental aspects of Integrated Circuit (IC) layout design.

ECMF202

This subject provides knowledge and know-hows in engineering as well as troubleshooting of wafer fabrication process. It covers the various process technologies of IC wafer fabrication like oxidation, photolithography, etching, implantation and film deposition etc. The essential knowledge and know-hows to perform process recipe setup and troubleshooting will also be covered.

Post-Diploma Certificate in Wafer Fabrication Equipment Technology

Subject code Subject
ECMI202

This subject provides know-how and skills in handling vacuum systems and operating plasma equipment which are widely used in the wafer processing industry. It covers topics like high vacuum pumps, pressure gauges, vacuum materials, leak detection, plasma physics and high density plasma   technologies. The operation and maintenance of vacuum system, plasma reactors and leak detection techniques will be covered through practical sessions.

ECMF203

This subject provides know-how and skills in engineering and troubleshooting of wafer fabrication equipment. It covers commonly found equipment modules such as AC and DC power distribution, process gas P&ID, (pipe and instrumentation diagram), and mass flow control, heat exchangers and temperature control, wafer handling and transportation, pneumatic circuits, interlock and safety systems, as well as PID controllers. Through practical sessions, the reading of equipment schematic, diagnostic and troubleshooting of wafer fabrication equipment modules will also be covered.

ECPJ201

In this subject, students will integrate and apply their knowledge as well as skills learned to their project in a practical environment. The emphasis will be on knowledge and skills application innovation and creativity.  The project nature should be of the following nature:

  • It must be a substantial work related to an industrial program.
  • It may be an innovative product, system or process; or an improvement to existing product, system or process.
  • It may include some form of developmental work and evaluation of workable designs and implementation of ideas. 

The company project will commence concurrently with Post-Diploma Certificate in Wafer Fabrication Equipment Technology.

Modes of Assessment

Class Participation

Quizzes

Test

Laboratory work

Assignment

Project

Course Fees

Category

PDC in Wafer Fabrication Manufacturing & Process

PDC in Wafer Fabrication Equipment Technology

Enhanced Training Support for SME Scheme

$278.04

$417.06

Singapore Citizens below the age of 40

$398.04

$597.06

Singapore Permanent Residents

$1,052.88

$1,579.32

(nett fee payable inclusive of GST)

MOE subsidy will not be applicable for students who repeat a module or semester.
Fees payable is based on per PDC.
The course fees will be reviewed by MOE on an annual basis and adjusted accordingly.

Eligibility Criteria

Eligibility Criteria for ELP Electronics

Singaporeans or Singapore Permanent Residents who are within three years of either graduation from the polytechnics or the Operational Ready Date (ORD) for National Servicemen from relevant full-time engineering-related courses of study are eligible to apply. 

Eligibility Criteria for ELP Sign-on Incentive

Only for Singapore Citizens who are fresh Polytechnic graduates hired by participating companies and officially commenced ELP within 3 years of graduation or ORD.

Application and Enquiries

Application and Enquiries

Individuals

Interested applicants may email the following documents with the subject “ELP Electronics/ Specialist Diploma in Wafer Fabrication” to Ms Chelsia Lim | chelsia@tp.edu.sg

  1. Resume
  2. Highest Qualification Certificate & Transcripts
  3. NRIC
  4. National Service Completion Certificate (if applicable)
  5. Relevant Supporting Document such as Testimonial (optional)

Please note that all resumes will be forwarded to all participating companies for their selection.

Selection of applicants is at the discretion of the participating companies and participating companies will contact their shortlisted applicants for interview. Applicants have the right to reject the interview if they are not comfortable in working with the company who contacted them.

Only applicants who are hired by the participating companies will be invited to submit an online application for the Earn and Learn Programme. 

Employers

Companies in the semiconductor industry who are interested to find out how ELP can support your organisation’s talent development plan may contact the following personnel for more information:


 
EVENTS   | All Events
04
JAN

TP Openhouse 2018

Temasek Polytechnic
04 - 06 Jan 18
06
JAN

Beyond 'O' Level Seminar 2018

Temasek Polytechnic
06 Jan 18