Mr Wong and Mr Chan sealing the agreement
The School of Engineering, Temasek Polytechnic, has signed a Memorandum of Understanding (MOU) with Singapore Technologies (ST) Electronics Ltd on 22 Mar 2016.
In a nutshell, under the MOU, both parties have agreed to collaborate on research & development on green building technologies related to the analysis of building performance and energy efficiency, test-bedding of proposed solutions and sharing of knowledge and expertise.
ST Electronics will provide the necessary resources and expertise, including an interface to TP’s Estate & Facilities Management office for relevant data gathering and processing, and helping to develop additional features in the system.
Temasek Polytechnic, on its part, has agreed to allow the use of its Building Performance & Analytic (BPA) lab and related facilities within the School of Engineering to conduct research and to develop a solution to analyse building facilities energy performance efficiency. It will also adopt the Singapore and international guidelines and standards for measurement and verification to be used as the benchmark for analysis, carry out the required data analysis for projects, and provide resources to support solution test-bedding.
The collaboration, first inked in 2013, has and will continue to enhance the capabilities of our Diploma in Green Building & Sustainability.
The MOU was signed by Mr Eric Chan, Vice President of ST Electronics Ltd, and Mr Wong Kia Ngee, Director of School of Engineering, Temasek Polytechnic.