Specialist Diploma in Wafer Fabrication


This course will enhance your knowledge and skills and enable you to undertake engineering functions in the field of wafer fabrication in the semiconductor industry.

Upon graduating from the course, you will be equipped with the following engineering functions:

  • wafer fabrication manufacturing practices
  • various core processes of wafer fabrication
  • equipment engineering and troubleshooting


Target Participants
The intended target participants are fresh graduates and working professionals who possess a Polytechnic diploma in Engineering or University degree in Engineering or Physical Science.

This course is eligible for SkillsFuture Study Award. For more information, please visit the website below.
http://www.skillsfuture.sg/studyawards/electronics

 Course Information

Course Date:

15 April 2019

Course Duration:

Part-Time / 1 year

This course consists of 2 Post-Diploma Certificates (PDC)

Course Frequency:

1 time a week, 9am – 5pm on one weekday

Application Period:

01 November 2018 - 07 January 2019

 Course Fees

Course Fee Per Post-Diploma Certificate

 

PDC 1: Wafer Fabrication Manufacturing & Process

PDC 2: Wafer Fabrication Equipment Technology

Workfare Training Scheme (WTS)1 

$135.72

$203.58

SME-sponsored Singapore Citizens

$251.52

$377.28

Singapore Citizens aged 40 & above

$243.96

$365.94

Singapore Citizens aged below 40

$359.52

$539.28

Singapore Permanent Residents

$963.00

$1,444.50

Others & Repeat Students

$2,401.08

$3,601.62



For more details, please click here.

(nett fee payable inclusive of GST)
1Please refer to www.workfare.sg for more information on WTS
MOE subsidy will not be applicable for students who repeat a module or semester.
Fees payable is based on per MC.
The course fees will be reviewed by MOE on an annual basis and adjusted accordingly.

 Career Opportunities

At the entry level, the job positions are Associate Engineers. Upon completing the course under the Earn and Learn Programme, graduates can look forward to role expansion in their work scope. They can also look forward to upgrading their knowledge and skills through further CET and executive programmes offered by local Institutes of Higher Learning.


 Contact Us

 
  6788 1212
 

Temasek SkillsFuture Academy 
(East Wing Block 1A, Level 3, Unit 81)

What You Will Learn

To be awarded the Specialist Diploma in Wafer Fabrication, students are required to complete a total of 2 Post-Diploma Certificates (PDCs). Each PDC can be completed in 1 semester, ie. 6 months. A certificate will be issued once the requirements for each PDC are met. ELP students must complete the course within 12 months.

Post-Diploma Certificate in Wafer Fabrication Manufacturing & Process

Option A: Manufacturing Practices

Subject code Subject LevelCredit Units
ECMF201

This subject provides students with the knowledge and skills of the various techniques and concepts used in Applying Semiconductor Good Manufacturing Practices and Managing Semiconductor Manufacturing Execution System (MES) that are widely used in the wafer fabrication Industry Good manufacturing practices requirements and cleanroom protocols, operations of the Manufacturing Execution System and the application in tracking tool and lot status will be included.

ECSC201

This subject provides students with the knowledge and skills of the various techniques and concepts in Applying Environmental, Health and Safety (EHS) Practices that are widely used in the wafer fabrication industry. It covers responsibilities under EHS Act, hazards, risk assessment, and safe work procedures as well as knowledge and/or practice of sustaining the environmental health and safety. Knowledge of these techniques will allow professional engineers to work safely and effectively so as to improve their factory performance.

ECPZ201

This subject provides students with the knowledge and skills of the various techniques and concepts in Implementing Statistical Process Control (SPC) that are widely used in the wafer fabrication Industry. It covers basic statistics, control chart, process capability as well as application of the concepts and methodology of SPC learned. Knowledge of these techniques will allow professional engineers to improve on the processes and the company’s performance, and manage abnormal SPC trend.

Option B: Process Technology

Subject code Subject LevelCredit Units
ECMI201

This subject provides the basic knowledge and understanding of semiconductor materials, p-n junctions, different types of contacts to semiconductors, the Metal-Oxide-Semiconductor (MOS) capacitor and MOS Field Effect Transistor (MOSFET). The subject also covers the various types of semiconductors memory devices and fundamental aspects of Integrated Circuit (IC) layout design.

ECMF202

This subject provides knowledge and know-hows in engineering as well as troubleshooting of wafer fabrication process. It covers the various process technologies of IC wafer fabrication like oxidation, photolithography, etching, implantation and film deposition etc. The essential knowledge and know-hows to perform process recipe setup and troubleshooting will also be covered.

Post-Diploma Certificate in Wafer Fabrication Equipment Technology

Subject code Subject LevelCredit Units
ECMI202

This subject provides know-how and skills in handling vacuum systems and operating plasma equipment which are widely used in the wafer processing industry. It covers topics like high vacuum pumps, pressure gauges, vacuum materials, leak detection, plasma physics and high density plasma   technologies. The operation and maintenance of vacuum system, plasma reactors and leak detection techniques will be covered through practical sessions.

ECMF203

This subject provides know-how and skills in engineering and troubleshooting of wafer fabrication equipment. It covers commonly found equipment modules such as AC and DC power distribution, process gas P&ID, (pipe and instrumentation diagram), and mass flow control, heat exchangers and temperature control, wafer handling and transportation, pneumatic circuits, interlock and safety systems, as well as PID controllers. Through practical sessions, the reading of equipment schematic, diagnostic and troubleshooting of wafer fabrication equipment modules will also be covered.

ECPJ201

In this subject, students will integrate and apply their knowledge as well as skills learned to their project in a practical environment. The emphasis will be on knowledge and skills application innovation and creativity.  The project nature should be of the following nature:

  • It must be a substantial work related to an industrial program.
  • It may be an innovative product, system or process; or an improvement to existing product, system or process.
  • It may include some form of developmental work and evaluation of workable designs and implementation of ideas.

The company project will commence concurrently with Post-Diploma Certificate in Wafer Fabrication Equipment Technology.

Modes of Assessment

Class participation

Class tests

Assignments

Projects

Minimum Entry Requirements

 At least a Polytechnic diploma (or equivalent) in Engineering or University degree in Engineering or Physical Science. 

Holders of other equivalent academic qualifications will be considered on a case-by-case basis.

Apply Now

Application Procedures & Enquiries

Submit on-line application via: https://cetoas.tp.edu.sg/Account/Logon

Temasek SkillsFuture Academy
Temasek Polytechnic
(East Wing Block 1A, Level 3, Unit 81)
21 Tampines Ave 1
Singapore 529757

Opening Hours
8.30 am to 7.00 pm (Mon to Fri)
Closed on Sat, Sun & Public Holidays

Contact Details
Tel: 6788 1212
Email: tsa_acadcet@tp.edu.sg
URL: http://www.tp.edu.sg/tsa

Temasek Polytechnic reserves the right to alter the course, modify the scale of fee, amend any other information or cancel course with low enrolment.

Last updated 1 November 2017