Gives an overall view of the complete Integrated Circuit (IC) manufacturing process and introduces the related equipment and facility systems for IC assembly and electrical testing. Students will discuss various manufacturing issues such as quality, in-line process monitoring, manufacturing defects, and aspects of IC failure analysis and reliability. Students will also be taught test specifications, test generation, tester interfaces, and the modules of a typical IC test system.

Provides fundamental knowledge of semiconductor energy bands, material properties, and the characteristics of semiconductor materials used in modern electronic devices. Covers the operating principles of MOS capacitors and the characterization of semiconductor devices such as diodes and MOSFETs. Students will also learn the fundamental aspects of IC layout design and become familiar with the topographic representation and structure of an integrated circuit chip.

Provides fundamental knowledge of complementary metal-oxide-semiconductor (CMOS) processes and process integration used in semiconductor manufacturing. Students will learn the principles and methods involved in setting up and troubleshooting wafer fabrication processes. Covers key IC wafer fabrication technologies such as doping, photolithography, etching, thin film deposition, and chemical mechanical polishing (CMP). Students will also gain exposure to process recipe setup and troubleshooting techniques used to support manufacturing operations and process optimisation.

Provides an understanding of cleanroom design principles and contamination control methods used in semiconductor manufacturing environments. Students will learn about the essential facilities and systems that support cleanroom operations and ensure controlled processing conditions. The subject also introduces vacuum technology widely used in semiconductor wafer processing and covers fundamental concepts, leak detection methods, and basic vacuum troubleshooting techniques used in industry applications.